At Insidix, we are dedicated to advancing thermal warpage measurement, providing our clients with the most accurate and reliable solutions. Join us as we innovate and lead the way in high-precision measurement technologies.
Pioneering Thermal Warpage Measurement Since 1996
Insidix is your trusted leader in thermal warpage measurement solutions. Established in 1996 in Grenoble, France. Insidix began as a provider of non-destructive testing services, quickly gaining a reputation for excellence in the French market. With a commitment to leveraging cutting-edge technologies, we expanded our expertise to serve the microelectronics, automotive, aerospace, defense, and medical industries.
In 2006, Insidix embarked on a dedicated R&D journey to develop a revolutionary solution for analyzing component behavior under thermo-mechanical stress. This initiative led to the creation of the Topography Deformation Measurement (TDM) machine, introduced to the European market in 2007 and later expanded to the U.S. and Asian markets. Utilizing advanced Projection Moiré technology, TDM offers unmatched accuracy in temperature-dependent warpage measurement.
TDM R&D has driven significant advancements, resulting in critical milestones such as the launch of TDM LS and Cpt2 in 2014, TDM Tabletop in 2015, and Compact-3 in 2018. In 2022, we expanded our global footprint with satellite offices in Osaka, Japan, and Virginia, USA, while introducing next-generation CPT-3 and OCT with advanced projection modes and enhanced efficiency.
Core Technology
Our company uses cutting-edge TDM technology to measure thermal warpage. Our thermal chambers are equipped with exceptional capabilities that use convection and IR elements to achieve a broad temperature range from -65°C to 400°C. Our ramp rates, stability, and homogeneity exceed industry standards, making our technology a superior choice for thermal warpage measurement.
Our technology is based on the Phase-Shifting Projection Moiré principle. This principle allows us to accurately detect any topographical deformation and coplanarity issues in devices being tested. We capture measurements in real time while the devices undergo mechanical and thermal stress, ensuring that our results are highly accurate and reliable.
With TDM, you gain access to a comprehensive spectrum of analytical competencies. This includes 2D and 3D imaging, high-resolution warpage graphs compliant with JEDEC and IPC standards, and a range of comprehensive analyses such as CTE, strain, and vectorial plots. This wealth of information elevates your understanding and empowers your decision-making.