Applications

Thanks to its innovative technology and unique features, major companies in the electronics and semiconductor industries have chosen the TDM system for both quality control and R&D purposes. Our customers appreciate the technical advantages of the TDM system, including its high-resolution sensor, system versatility, and user-friendly interface.

The TDM system is a versatile instrument suited for a wide array of applications, including:

  • Product & Process Development

  • Failure Analysis

  • Reliability Testing

  • Quality Control

Whether you are enhancing your production processes or conducting in-depth research, the TDM system provides the precision and flexibility needed to achieve your goals.

Applications

Component Reflow

BGA Apps Briefing

PCB

PCP Apps briefing

Solder Ball

BGA Apps Briefing

Sockets

CPU Socket Briefing

Connector

Connector Connector Apps Briefing

Wafer

Wafer Apps Briefing

Power Module

BGA Apps Briefing

PANEL

Panel Apps Briefing

PANEL LEVEL PACKAGE

PLP Apps Briefing

STRIPS

CSP Apps Briefing

MULTI-SCALE

Multi Scale Apps Briefing

CTE + STRAIN

CTE Strain Apps Briefing

SUBROOM

Neg Temp Apps Briefing